Micro- and nano structuring by means of laser radiation

Interference effects at a laser structured surface of a sleeve during the machining

The aim of the research is to create the prerequisites for the development of optimized processing technologies by acquiring a basic understanding of the primary and secondary processes involved in the interaction of laser photons with materials, thin films or thin film systems. This knowledge enables technological developments for the precise, efficient and low defect structuring of materials for increasing functionality of such structured materials for various applications. Typical laser micromachining processes include laser ablation, laser etching and laser photon-induced surface modification processes. The technical/technological implementation of the scientific findings in technical machining processes is carried out on industry-standard laser material processing workstations equipped with different laser sources with wavelengths in the range of UV to IR (λ = 248 nm to λ = 1550 nm) and pulse lengths from femto to sub-microseconds (tp = 150 fs to 0.6 μs). The laser beam energy can be applied to the workpiece in different manner, for example, by focusing, mask projection or interference techniques. In-process analysis techniques can be used for optimizing the laser material processing with the goal of increasing the accuracy of structuring and to support digital production. To characterize the laser processing result, the analytical capabilities of the IOM are used specifically.