Micro- and nanostructuring with lasers

The research group deals with the development of laser-induced processes for the modification and structuring of surfaces and thin films with applications in micro- and nanotechnology. In addition to elucidating the physical cause of the laser process, the aim is to optimize the process (small structure widths, precise adjustment of the ablation depth, selective layer ablation, minimal damage to materials or component functions). The modification and structuring is preferably carried out with ultrashort laser pulses, which stimulate non-thermal laser photon-material interactions and thus enable new material processing processes. In addition to laser ablation, innovative laser-induced processes for micro/nanostructuring and material modification are increasingly being used. The research group has a large number of different laser sources at its disposal that are close to industry and suitable for basic research. These cover a wavelength range from UV to IR (λ = 248 nm to λ = 1550 nm) and a pulse length range from femto to submicroseconds (tPuls = 150 fs to tPuls = 0.6 µs). These laser sources are integrated into modern material processing systems that comply with industrial standards. In these laser systems the laser processing can be carried out by scanners as well as high-precision axis systems. In addition to these classical processing techniques, other laser processes are also available, such as mask projection. The characterization and optimization of the laser processes is supported by a multitude of different in-situ and ex-situ analysis methods.

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