The objective of the 10ÅCe pThe objective of the 10ÅCe project is to explore and realize solutions for the 10Å CMOS chip technology. The project consortium covers the entire value chain for manufacturing of the CMOS chips in the 10A node, that is, from chip design to lithography to process technology and finally chip metrology. Essential parts of hardware, software and processing technology are developed pushing the boundaries of semiconductor design and manufacture to enable the new node and keep Moore’s law alive.
Link: https://cordis.europa.eu/project/id/101139972

National co-financing of 50% each by the BMBF and SMWA in the joint project "Technologies for 10 Ångstrom lithography in chip production - 10ÅCe" within the European microelectronics funding programme CHIPS.
Link: https://www.elektronikforschung.de/projekte/10ace

Duration: 5/2024 – 4/2027
Funding (total): 98.128.492,75 Euro
H2020 Funding IOM: 999.481,25 Euro
Funding programme: HORIZON.2.4 - Digital, Industry and Space, HORIZON.2.4.2 - Key Digital Technologies
Coordination: ASML NETHERLANDS B.V.

Cooperation partner: 30

Contact IOM:
Dr. Frank Frost
Field of Research Ultra-precision Surfaces / Ion beam assisted patterning and smoothing
Phone: 49 (0)341 235-3309
E-Mail: frank.frost(at)iom-leipzig.de