Semiconductor research and development continuously focuses on surpassing present state-of-the-art Micro-Chips manufacturing technology to accommodate the exponential increase in demand for more processing power. To increase the number of transistors per chip, the EU-funded IT2 project develops next generation extreme UV lithography and explores novel 3D structures. Much like building an apartment complex rather than a single-family home on the same real estate. The project will enable future chips that will be at the core of AI, Big Data, Mobile/5G communication and other elements of Europe's digitisation. In this way, the project develops knowledge and infrastructure to give Europe’s semiconductor manufacturing equipment industry global leadership in 2nm CMOS technology and supports Europe to obtain a sovereign position in the electronics value-chain.

Link: https://cordis.europa.eu/project/id/875999

Duration: 2020 – 2023 
H2020 Funding (total): 91.638.509,26 Euro
H2020 Funding IOM: 990.562,50 Euro
Funding programme: H2020-EU.2.1.1.7. - ECSEL
Coordination: ASML NETHERLANDS B.V.

Cooperation partner: 31

Contact IOM:
Dr. Frank Frost
Field of Research Ultra-precision Surfaces / Ion beam assisted patterning and smoothing
Phone: 49 (0)341 235-3309
E-Mail: frank.frost(at)iom-leipzig.de

This project has received funding from the ECSEL (Electronic Components and Systems for European Leadership) Joint Undertaking (JU) under grant agreement No 875999. The JU receives support from the European Union’s Horizon 2020 research and innovation programme and Netherlands, Belgium, Germany, France, Austria, Hungary, United Kingdom, Romania, Israel.