2024-2027
In the “nanoAR” project, the project partners are combining their expertise in manufacturing and processing methods to effectively reduce SSD (subsurface damage) by means of technology-open process development for nanostructure generation, including the use of simulation and modeling, high-resolution material characterization and the development of new methods for quality assurance.
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Duration: 2024 – 2027
The objective of the EU project is to explore and realize solutions for the 10Å CMOS chip technology. The project consortium covers the entire value chain for manufacturing of the CMOS chips in the 10A node, that is, from chip design to lithography to process technology and finally chip metrology. Essential parts of hardware, software and processing technology are developed pushing the boundaries of semiconductor design and manufacture to enable the new node and keep Moore’s law alive.
Link: https://cordis.europa.eu/project/id/101139972
Duration: 01/24 - 12/25
In a joint project funded by the BMBF and the GRAVOmer network, researchers from the IOM research area "Reactive Ion Beam Assisted Structuring and Smoothing", together with Carl ZEISS Jena GmbH and scia Systems GmbH, want to establish novel ion beam-based manufacturing processes with which inclined surface profiles (blaze profiles) for diffractive optical elements (DOE) can be realised that are not accessible with previous technologies. To this end, a new ion beam etching technology for the production of monolithic, blazed silicon diffraction gratings for beamline applications in the VUV, EUV and X-ray range is to be developed on the basis of lithographic structure definition. In particular, if successful, enormous performance increases can be realised through more sharply defined blaze edges, especially against the background of constantly decreasing blaze angles.
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This project is dedicated to the exploration of methods for the advanced manufacturing of spatially coherent, homogeneous, and high-quality compound one-dimensional nano-heterostructures by principles of oblique angle deposition in combination with assist ion bombardment (iGLAD). One assist ion source implemented into the fabrication process will be subsequentially operated for i) substrate pre-patterning via ion erosion, ii) control of phase and stoichiometry via reactive ion bombardment, and iii) nanostructure size control via ion figuring. A hypothesis-driven approach is employed to investigate nucleation, growth, interface formation, surface patterning and nanostructure crafting for the fabrication of metal oxide nano-heterostructures in correlation to process parameters such as ion energy, ion current density, angle of incidence and ion mass, using ZrO2-MoO3-x as a model substance.
This proposal is based on mutual scientific interest in low-energy reactive ion beam processing for advanced additive manufacturing and combines expertise from Dr. Eva Schubert, Associate Professor at the University of Nebraska-Lincoln (U.S.A.) and Dr. Frank Frost, Head of Division for Ion Beam Assisted Patterning and Smoothing at the Leibniz Institute of Surface Engineering (IOM) in Leipzig (Germany). High resolution STEM imaging in combination with EDX elemental analysis will be conducted by Dr. René Feder, Team Manager Hybrid Systems, from IOM sub-contractor Fraunhofer-Institute for Microstructures of Materials and Systems in Halle/Saale.
In diesem industriegeführten ECEL-Projekt bringen insgesamt 32 Partner ihre Kompetenzen ein. Gesamtziel des IT2-Projekts ist die Erforschung, Entwicklung und Demonstration von Technologieoptionen zur Realisierung der 2 nm-CMOS-Logik-Technologie. Die Aktivitäten umfassen Lithographie, Prozess- und Modulexploration und Messtechnik. Das IOM entwickelt mit seinen Partnern einen optimierten Ionenstrahlprozess, einschließlich der notwendigen Werkzeuge für die hochpräzise Herstellung von strukturierten EUV-Optiken mit deutlich höherer Effizienz und zusätzlicher Unterdrückung unerwünschter Wellenlängenbereiche.
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